Headline: Transdisciplinary knowledge integration PART II: Experiences of five transdisciplinary processes on digital data use in Germany

Transdisciplinary problems are complex, ill-defined, societal real-world problems with high ambiguity that are contested and require multiple trade-offs. Part I of this paper showed that transdisciplinary processes include seven types of knowledge integration: system (ontological), epistemological, cultural, cognitive, social conflict, evolutionary (levels of representation), and complexity-theory-based types of knowledge integration. The epistemological integration of the different modes of reasoning from science and practice is a unique selling point of the transdisciplinary process. Part II presents five transdisciplinary processes for the responsible use of digital data in different vulnerable/sensitive subsystems of Germany (mobility, health, agriculture, SME, and social media). Between 10 and 18 participants (equally representing science and practice in each group) synchronously constructed socially robust orientations as pillars of a white book. We elaborate that outcomes of a transdisciplinary process can be improved, and barriers diminished by reflecting on which of the seven types of knowledge integration are applied (see Part I). This is done for the six phases of a transdisciplinary process: (1) triggering, (2) initiation, (3) preparation, (4) planning, (5) core, and (6) post-processing. We particularly address researchers and practitioners who seek insights into how the production and integration of knowledge can be improved by transdisciplinary processes.

Publication Year
2024
Publication Type
Academic Articles
Citation

Scholz, R., Köckler, H., Zscheischler, J., Czichos, R., Hofmann, K.-M., & Sindermann, C. (2024). Transdisciplinary knowledge integration PART II: Experiences of five transdisciplinary processes on digital data use in Germany. Technological forecasting and social change: an international journal, 199: 122981. doi:10.1016/j.techfore.2023.122981.

DOI
10.1016/j.techfore.2023.122981